MPPO Snap On BGA JEDEC Matrix Tray 322.6x135.9x7.62mm 55 Cavities Stackable with Lid

Name: MPPO Snap On BGA JEDEC Matrix Tray 322.6x135.9x7.62mm 55 Cavities Stackable with Lid
Brand: Shenzhen Hiner Technology Co., Ltd.

Durable MPPO JEDEC matrix tray with secure snap-on lid for BGA and IC components. Anti-static, RoHS certified, supports 0°C to +180°C. Ideal for automated handling, SMT lines, and cleanrooms. Accept OEM/ODM customization.

Cavity size/mm 8.2*7.2*1.38

Place of Origin China

Lid Type Snap-On

Size Standard

Packaging Details 70~100pcs/carton(According to the customer demand）

Product Name JEDEC Matrix Trays

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Product Description

MPPO Snap On BGA JEDEC Matrix Trays Stackable With Secure Lid Protection

Designed with your product in mind, our JEDEC trays support tight tolerances and automated handling systems.

The trays are made from MPPO material, which provides excellent durability and resistance to impact and stress. The temperature range of the JEDEC Matrix Trays is also impressive, with a range of 0°C to +180°C. This makes them suitable for use in a wide range of environments and applications, including in the manufacturing of electronic components and devices.

For those in the electronics industry, the JEDEC Matrix Trays are an ideal choice for safely storing and transporting delicate components. Additionally, the JEDEC Matrix Trays are anti-static, providing a further layer of protection against damage from static electricity. This makes them an ideal choice for use in environments where static electricity may be a concern, such as in clean rooms or other sensitive manufacturing environments.

Technical Parameters:

Brand	Hiner-pack	Outline Line Size	322.6135.97.62mm
Model	HN23044	Cavity Size	8.27.21.38 mm
Package Type	IC Component	Matrix QTY	11*5=55PCS
Material	MPPO	Flatness	MAX 0.76mm
Color	Black	Service	Accept OEM, ODM
Resistance	1.0x10e4-1.0x10e11Ω	Certificate	RoHS

Applications:

Ideal for semiconductor packaging, testing, and automated board assembly operations, this tray excels where component integrity and process efficiency are priorities. It supports robotic pick-and-place activities and integrates into handling systems without the need for modification. The tray is also suitable for environments requiring frequent movement between stations—such as SMT lines, cleanrooms, or IC programming labs—where consistent component orientation and secure seating are essential.

Customization:

Adapt the tray’s internal layout and appearance to meet unique manufacturing or part-specific needs:

• Customized Pocket Geometry: Modify cell shapes, wall heights, or part-retention details to accommodate varied device profiles.

• Color Selection: Choose ESD-safe colors to differentiate production batches, product types, or workflow stages.

• Integrated Molded Identification: Add part numbers, process codes, or customer logos as permanent molded features for easy traceability.