JEDEC IC Matrix Tray 322.6x135.9mm Height 7.62mm for BGA QFP QFN Packaging
Standard JEDEC matrix tray for 90% of IC types including BGA, CSP, QFP, and QFN. Features stackable design, ESD-safe materials, and compatibility with automated equipment. ISO 9001 SGS ROHS certified. Custom sizes and materials available.
Product Description:
JEDEC matrix trays have standard dimensions of 12.7 x 5.35 inches (322.6 x 136mm). It's suitable for 90% of standard components including BGA, CSP, QFP, TQFP, QFN, TSOP and SOIC.
Moreover, low profile trays are specially designed with a thickness of 0.25-inch (6.35mm), which can neatly accommodate these components.
Features:
JEDEC IC matrix trays are the industry standard in semiconductor manufacturing, with decades of history and usage familiar to a global audience. The trays feature compatibility with most semiconductor production equipment, helping widen their success and appeal.
Underneath, trays act as containers for semiconductor parts; the JEDEC matrix tray outline includes details for stacking, as each tray can become the cover for the tray below.
Loaded with parts, JEDEC matrix trays can be both stored and transported, either across the room or around the world. Their versatility also serves them well here as they perform equally well as a process “boat” for transporting contents through a variety of process tools and equipment.
The trays themselves provide valuable protection from mechanical damage, with many also exhibiting electrical protection from electrostatic discharge (ESD) damage due to their material construction.
Technical Parameters:
JEDEC Matrix Trays are the ideal choice for the precise handling and protection of components in a mechanized environment. With components arranged in uniform patterns, the task of automation and associated programming become much easier. Besides, these trays have a broad range of applications, including but not limited to the semiconductors, electrical components, optical and photonic products, and mechanical parts. Companies usually pick those trays for promoting pick and place automation and standardizing the manufacturing equipment. Most of them are made of ESD-safe engineering plastic.
Applications:
Hiner-pack JEDEC TRAY SERIES are perfect for electronic components IC chips, core tray racking, and electronic components ICs packaging. These trays are constructed of durable and reliable materials, such as MPPO, PPE, ABS, PEI, and IDP, with a height of 7.62mm and a size of 322.6*135.9mm. With a tray weight of 120~200g, they are suitable for automated equipment and other IC packaging needs. Hiner-pack JEDEC TRAY SERIES are certified by ISO 9001 SGS ROHS, and are available in minimum order quantities of 500. The price is TBC, and delivery time is 1~2 weeks with payment terms of 100% prepayment and supply ability of 2000pcs/day. The packaging details are 80~100pcs/carton.
Customization:
- Model Number: JEDEC TRAY SERIES
- Place of Origin: China
- Certification: ISO 9001 SGS ROHS
- Minimum Order Quantity: 500
- Price: TBC
- Packaging Details: 80~100pcs/carton
- Delivery Time: 1~2 Weeks
- Payment Terms: 100% Prepayment
- Supply Ability: 2000PCS/Day
- Height: 7.62mm
- Application: IC Packaging
- Size: 322.6*135.9mm
- IC Type: BGA,QFP,QFN,LGA,PGA
- Tray Features: Stackable
Hiner-pack JEDEC IC Trays are specially designed for the packaging of electronic components IC Chips. They are made of cardboard and feature stackability. The trays come in dimensions of 322.6*135.9mm with a height of 7.62mm. They are ideal for packaging BGA, QFP, QFN, LGA, and PGA type ICs.
- High quality cardboard trays
- Stackable design
- Ideal for IC Chips packaging
- Compatible with BGA, QFP, QFN, LGA, and PGA ICs
FAQ:
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