Customized Black Micro Cavity JEDEC Matrix Tray HN21101 - 322.6×135.9mm, 230 Cavities for IC Components

Name: Customized Black Micro Cavity JEDEC Matrix Tray HN21101 - 322.6×135.9mm, 230 Cavities for IC Components
Brand: Shenzhen Hiner Technology Co., Ltd.

Professional JEDEC Matrix Tray with 230 cavities measuring 7.1×7.8×3mm each, manufactured from MPPO material for superior thermal stability up to 150°C. Features 322.6×135.9mm standard dimensions, ROHS/SGS certifications, and compatibility with BGA, QFP, TQFP, QFN components. Custom OEM/ODM services available with short delivery times.

Temperature 150°C

Place of Origin Shenzhen China

Surface resistance 1.0x10E4~1.0x10E11Ω

Customized service Support standard and non-standard,precision machining

Packaging Details 80~100pcs/per carton, Weight about 12~16kg/per carton, Carton size is 35*30*30mm

Color Black

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Product Description

Product Overview

JEDEC Matrix trays are standardized carriers designed for the safe transportation, packaging, and storage of IC chips and electronic components. These trays feature a consistent profile size of 322.6mm × 135.89mm (12.7" × 5.35") and are available in multiple configurations to meet diverse industry requirements.

HN21101 JEDEC IC Tray Specifications

Outline Dimensions	322.6 × 135.9 × 12.19mm	Brand	Hiner-pack
Model Number	HN21101	Package Type	N/A
Cavity Size	7.1 × 7.8 × 3mm	Matrix Quantity	10 × 23 = 230 PCS
Material	MPPO	Flatness	MAX 0.76mm
Color	Black	Services	OEM, ODM Accepted
Surface Resistance	1.0×10⁴-1.0×10¹¹Ω	Certifications	ROHS, SGS

Material Temperature Resistance Reference

Material	Bake Temperature	Surface Resistance
PPE	125°C~Max 150°C	1.0×10⁴Ω~1.0×10¹¹Ω
MPPO + Carbon Fiber	125°C~Max 150°C	1.0×10⁴Ω~1.0×10¹¹Ω
MPPO + Carbon Powder	125°C~Max 150°C	1.0×10⁴Ω~1.0×10¹¹Ω
MPPO + Glass Fiber	125°C~Max 150°C	1.0×10⁴Ω~1.0×10¹¹Ω
PEI + Carbon Fiber	Max 180°C	1.0×10⁴Ω~1.0×10¹¹Ω
IDP Color	85°C	1.0×10⁶Ω~1.0×10¹⁰Ω

Key Features & Benefits

Manufactured from MPPO material offering excellent transparency and thermal stability
Environmentally friendly construction with no pollution concerns
230-cavity matrix design accommodates multiple chip products efficiently
Compatible with 90% of standard components including BGA, QFP, TQFP, and QFN
Complies with international JEDEC standards for semiconductor packaging
Customizable configurations available to meet specific customer requirements

Company Advantages

Over 10 years of export experience with global market presence
Professional engineering team and efficient management systems
Short delivery times with regular stock availability
Small quantity orders accepted for flexible purchasing
24-hour customer service response for prompt support
ISO certified manufacturing with ROHS compliant products

Product Images

Customized Black Micro Cavity JEDEC Matrix Tray for IC Components showing detailed cavity structure

Close-up view of HN21101 JEDEC IC Tray with 230 cavities for semiconductor packaging

Frequently Asked Questions

How to request a quotation?
Provide detailed requirements for immediate pricing. Contact via Skype, Email, or Phone for fastest response.

Response time?
All inquiries receive responses within 24 hours during business days.

Available services?
Complete design-to-shipping solutions including custom IC tray drawings based on component specifications.

Delivery terms?
Multiple options including EXW, FOB, CIF, DDU, and DDP for customer convenience.

Quality assurance?
Rigorous testing ensures 100% compliance with international JEDEC standards.