Silicon Carbide CMP Tray
SiC CMP Tray Silicon Carbide CMP tray is formed by isostatic pressing process and sintering at high temperature. The outer diameter, thickness, number and size of acupoints, position and shape of the tablet groove can also be finished according to the requirements of the user's design drawings to meet the specific requirements of the user. Typical applications CMP(Chemical Mechanical Polish) in LED chip manufacturing, that is, chemical mechanical polishing process. Features
SiC CMP Tray
Silicon Carbide CMP tray is formed by isostatic pressing process and sintering at high temperature. The outer diameter, thickness, number and size of acupoints, position and shape of the tablet groove can also be finished according to the requirements of the user's design drawings to meet the specific requirements of the user.
- CMP(Chemical Mechanical Polish) in LED chip manufacturing, that is, chemical mechanical polishing process.
- Good thermal conductivity, low coefficient of expansion and temperature uniformity.
- Compared with the traditional corundum tray, the loading and unloading heating and cooling time is shortened, and the working efficiency is improved. At the same time, it can reduce the wear between upper and lower plates, maintain good plane accuracy and extend the service life by about 40%.
- The material has a small specific gravity and light weight, making it easier for operators to move the carrier tray, reducing the risk of collision damage caused by difficult handling by about 20%.
- Can be processed according to customer drawings, the maximum size: 500mm in diameter, flatness: 0.003mm within.
Silicon Carbide CMP Tray
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