Direct Bonded Copper Ceramic Substrate
Direct Bonded Copper Ceramic Substrate DBC ceramic substrate, short for "direct bonded copper ceramic substrate," is an advanced material consisting of a ceramic substrate (usually Al2O3 or AlN) and copper tightly bonded together through a hypoeutectic process. This unique combination of materials produces a substrate with exceptional thermal conductivity, low thermal expansion, high strength, and excellent wettability for soldering. Material properties of direct bonded
Direct Bonded Copper Ceramic Substrate
DBC ceramic substrate, short for "direct bonded copper ceramic substrate," is an advanced material consisting of a ceramic substrate (usually Al2O3 or AlN) and copper tightly bonded together through a hypoeutectic process. This unique combination of materials produces a substrate with exceptional thermal conductivity, low thermal expansion, high strength, and excellent wettability for soldering.
Material properties of direct bonded copper-ceramic substrates
-
Low thermal expansion
-
High strength
-
High thermal conductivity
-
High solder wettability
Applications of direct bonded copper-ceramic substrates
- Power electronics: IGBT, MOSFET, thyristor module, solid-state relay, diode, power transistors
- Automotive: ABS, power steering, DC/DC converter, LED lighting, ignition control system
- Household appliances: air conditioner, Peltier cooler
- Environmental technologies: Local power generation, electric vehicles, traction control systems, photovoltaic units, wind energy
Industry : LED displays, welding machines- Aerospace: laser, power source for satellites and aircraft
- PC/IT: power supply, UPS system
Recommended Products
