Dual Table PCB Laser Depaneling Machine 15W UV 355nm High Precision Cutting

Name: Dual Table PCB Laser Depaneling Machine 15W UV 355nm High Precision Cutting
Brand: Winsmart Electronic Co.,Ltd

High productivity dual table PCB laser depaneling machine with 15W UV 355nm laser. Achieves ±5μm cutting accuracy, ≤3000mm/s speed, and handles PCB/FPC up to 3mm thick. Non-contact, burr-free cutting with Gerber file support. Ideal for B2B industrial PCB depanelization.

Place of Origin China

Packaging Details Plywood case

Model Number SMTL300

Supply Ability 100 sets per month

After-sale Service Operation video and online support

Certification CE

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Product Description

Dual Table High Productivity PCB Laser Depaneling PCB Depanelizer Machine

Laser Depaneling Purpose:

The processing and application objects are PCB, FPC soft and hard plate and related material cutting, cover opening and other operations.

Efficient integration of all components of the equipment, including laser, optical path, galvanometer system, 4-axis motion platform and image

System to achieve efficient and accurate operation.

Laser Depaneling Specifications:

Power	380V AC, 50Hz, 20A
Compressed Air	Compressed air
Machine Dimension	1450(L)x1350(W)x1665(H)mm
Installation Space	3000x3000x2500mm
Machine Weight	2000kgs
Ambient Temperature	22 ~ 25 ℃
temperature variation	within ± 1 ℃ / 24hr
ambient humidity	within 40% ~ 70% (no obvious condensation is allowed)
Dust free grade	100000 or better
power consumption	6KW
Cutting width	≤ 50mm × 50mm
Cutting materials	full cut / half cut of PCB / FPC, LCP / glue and other related materials
Cutting thickness	≤ 3mm
Cutting speed	≤ 3000mm / S
Overall machining accuracy	≤ 30um
Processing pattern	straight line, slash, curve, abnormity, etc

Laser Depaneling Laser Source:

Laser	355nm light wave nanosecond laser
Repetition frequency	50-150khz
Laser Powe	UV 15W@30KHz
Pulse width	< 20ns
Energy stability	< 3% RMS over 8hours
Beam quality m ²	< 1.3
Mode	2500mm/S

Laser Depaneling Features:

Effectively control the processing heat effect, and improve the edge collapse and thermal effect of the product. High quality laser, no contact processing, no burr and burr after cutting. Mature process system can accurately calculate and segment the graphics, and realize the process of processing parameters and processing graphics. No stress, ±5μm cutting precision. Import gerber file for easy operation. Alien/line cutting is available. Non-contact, smooth cutting edge.

Laser Depaneling Laser Photos: