China Single Table Single Head ACF Bonding Machine with 500°C Temperature Control and 0.2mm Welding Precision for sale
China Single Table Single Head ACF Bonding Machine with 500°C Temperature Control and 0.2mm Welding Precision for sale

Single Table Single Head ACF Bonding Machine with 500°C Temperature Control and 0.2mm Welding Precision

Industrial ACF bonding machine featuring pulse heat technology, programmable temperature up to 500°C, and precise 0.2mm welding accuracy. Includes closed-loop PID control, floating thermode, and cylinder-controlled rotation platform with <0.02mm tolerance for reliable electronic component assembly applications.

Place of Origin China
CE Certificate Provide
Temperature Precision 2℃
Packaging Details Plywood case
Model Number SMTS01A
Supply Ability 200 sets per month
Product Description
Single Table Single Head Economic ACF Bonding Machine

Advanced cylinder-controlled ACF bonding system with precision temperature and pressure control for reliable electronic component assembly.

Key Features
  • Unique pulse heat technology for rapid soldering head heating
  • Programmable temperature, heat-up rate, and time duration settings
  • Closed Loop PID temperature control with LED display
  • Thermocouple positioned for accurate temperature feedback
  • Temperature-triggered soldering time programming
  • Floating thermode ensures consistent pressure and heat transfer
  • Programmable pressure switch with LCD display for precise force control
  • Optional CCD camera system with magnification lens for fine-pitch positioning
Technical Specifications
Parameter Specification
Machine Dimensions 550 × 640 × 620 mm
Working Area Maximum 150 × 110 mm
Machine Weight 62 kg
Working Air Pressure 0.6-0.8 MPa
Thermode Head Size Maximum 80 × 5 mm
Welding Precision 0.2 mm pitch
Pressing Time 1-99.9 seconds
Temperature Range RT to 500°C (±5°C tolerance)
Welding Pressure 1-20 kg
Power Supply AC220V ±10%, 50Hz, 2200W
Rotation Platform Cylinder control with <0.02 mm tolerance
Application
ACF Bonding Machine application in electronic component assembly
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