Optical Module Industrial Soldering Machine with 200×260mm Work Area and 0.2mm Precision for PCB Bonding
Professional pulse soldering machine featuring 2200W power, temperature range up to 500°C, and CCD alignment system. Ideal for LCD modules, solar batteries, and electronic components with 0.2mm welding precision and 1100N maximum bond force. Perfect for industrial PCB bonding applications requiring high accuracy and reliability.
This industrial pulse soldering machine utilizes advanced pulse heating reflow technology for precision PCB bonding applications. The process involves heating pre-coated flux and tinned components to melting temperature, creating permanent electrical and mechanical connections after curing.
| Parameter | Specification |
|---|---|
| Machine Dimensions | 680 × 780 × 750 mm |
| Working Area | Maximum 200 × 260 mm |
| Machine Weight | 135 kg |
| Working Air Pressure | 0.4-0.6 MPa |
| Jig Quantity | 2 units |
| Thermode Head Size | Maximum 80 × 5 mm |
| Welding Precision | 0.2 mm pitch |
| Pressing Time | 1-99.9 seconds |
| Temperature Range | RT to 500°C (±5°C tolerance) |
| Welding Pressure | 1-20 kg |
| Power Supply | AC220V ±10% 50Hz, 2200W |
| Alignment System | CCD + LCD Monitor |
| Rotation Platform Tolerance | <0.02 mm |
- Temperature range: 50°C to 600°C
- Temperature accuracy: ±1°C
- Bond timer: 0-12 seconds
- Bond air pressure: 0.4-0.6 MPa
- Pressure accuracy: ±0.05 MPa
- Maximum bond force: 1100 N
The system employs a 2000W transformer to generate high current at low voltage, rapidly heating through the welding joint. Pulse current frequency ratio determines output intensity and heating speed.
- LCD Module Manufacturing
- Solar Battery Production
- Camera Assembly
- Electronic Components
- Coil / Inductor Manufacturing
- Mobile Device Assembly
- PWB (Printed Wiring Board) Applications
- Power Devices
- General heating, fusing, joining, and forming operations
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