CCD Camera PCB Laser Depanelizer with 355nm UV Laser, 460mm x 460mm Work Area, ±2μm Precision
Advanced PCB depaneling machine featuring CCD camera alignment and 355nm UV laser technology. Delivers ±2μm positioning precision for depaneling flex/rigid PCBs, microvia drilling, and ceramic cutting. Software-controlled process eliminates mechanical stress, enables 2500mm/s scanning speed, and supports customizable 460mm x 460mm work area for high-density component placement.
Linear Line
20um
Place of Origin
China
Packaging Details
Plywood case
Scan Range
40x40mm
Model Number
SMTL460
Supply Ability
100 sets per month
Product Description
CCD Camera PCB Laser Depaneling Machine
Advanced UV laser depaneling system featuring CCD camera alignment for precision processing of flex and rigid PCBs with ±2μm positioning accuracy.
UV Laser Applications
- Depaneling flex and rigid PCBs
- Cover layer cutting
- Cutting fired and unfired ceramics
- Microvia drilling
- Skiving (cover layer removal)
- Pocket creation
Laser Technology Advantages
- Fully software-controlled process with adaptable parameters and laser paths
- No mechanical or thermal stresses on sensitive substrates
- Minimal cutting channel (few µm) for higher component density
- Production and setup process separation reduces operational errors
Technical Specifications
| Parameter | Specification |
|---|---|
| Laser Type | Q-Switched diode-pumped all solid-state UV laser |
| Laser Wavelength | 355nm |
| Laser Source | Optowave UV 15W@30KHz |
| Positioning Precision | ±2μm |
| Repetition Precision | ±1μm |
| Effective Working Field | 460mm x 460mm (Customizable) |
| Scanning Speed | 2500mm/s (maximum) |
| Working Field | 40mm x 40mm |
Production Image
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Price: USD1-150K/set
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