Machinery Electronics Production Machinery

China Highly Versatile Inline Laser PCB Depaneling Machine For Different Substrates for sale

Highly Versatile Inline Laser PCB Depaneling Machine For Different Substrates

Name: Highly Versatile Inline Laser PCB Depaneling Machine For Different Substrates
Brand: Shenzhen SMTfly Electronic Equipment Manufactory Limited

In Line laser PCB Depanel Machine Optional Inline or Offline Advantages of Laser PCB depaneling/singulation No mechanical stress on substrates or circuits No tooling cost or consumables. Versatility – ability to change applications by simply changing settings Fiducial Recognition – more precise and clean cut Optical Recognition before PCB depaneling/singulation process begins. Ability to depanel virtually any substrate. (Rogers, FR4, ChemA, Teflon, ceramics, aluminum, brass,

Place of Origin China

Packaging Details each set be packed in plywood case

Machine dimension 1480mm*1360mm*1412 mm

Model Number SMTfly-5L

Supply Ability 260 sets per month

Certification CE ROHS

co2 laser ent battery pack for speedlite laser pointer with green light

Product Description

In Line laser PCB Depanel Machine Optional Inline or Offline

Advantages of Laser PCB depaneling/singulation

No mechanical stress on substrates or circuits
No tooling cost or consumables.
Versatility – ability to change applications by simply changing settings
Fiducial Recognition – more precise and clean cut
Optical Recognition before PCB depaneling/singulation process begins.
Ability to depanel virtually any substrate. (Rogers, FR4, ChemA, Teflon, ceramics, aluminum, brass, copper, etc)
Extraordinary cut quality holding tolerances as small as < 50 microns.
No design limitation – ability to cut virtually and size PCB board including complex contours and multidimensional boards

Specification:

Specification
Cutting accuracy of the whole machine: 0.02mm	humidity: ＜60%
size of processed products: 330330mm/330670	floor loading: 1500kgf/m2
moving speed of the platform:300mm/s	human-computer operation and data storage:industrial computer
processing speed of the vibration mirror: ≤50000mm/s	size of the host computer: 125013001600 (L X H X D)mm
minimum processing line width : 0.0015mm	Machine Weight: 1500 Kg
positioning accuracy of the platform: 0.002mm	Equipment Source: AC220/3KW
operation interface: Chinese/English interface	operating system: Windows7
repeatability of the platform: 0.002mm	processing picture file: Gerber或DXF
size of the dust collector: 500650900 (L X H X D)mm	compensation for shrinkage and expansion: Automatic compensation of MARK points
ambient temperature: 20±2℃	dust collector: 1.5KW
power supply of the dust collector: AC 220V 50/60Hz	dust collector weight: 85Kg