High Tg HDI PCB Board
HDI PCB Technology For Telecommunication Industry 1. 12 layer PCB. 2. FR4 High Tg substrate. 3. Blind via,Buried via,VIP process. 4. Telecommunication application. 5. 0.063mm line width/space. 1 Layers 12 layer 2 Material FR4 high tg 3 PCB thick 1.65mm 4 Usage Telecommunication 5 Microvia 0.1mm 6 Min line track 0.063mm 7 Min space 0.063mm 8 Surface finish ENIG 3u' 9 Copper weight 1OZ inner and 2OZ outer 10 Soldermask Blue 11 Blind via Yes 12 Buried via Yes 13 Pads over via
1. 12 layer PCB.
2. FR4 High Tg substrate.
3. Blind via,Buried via,VIP process.
4. Telecommunication application.
5. 0.063mm line width/space.
| 1 | Layers | 12 layer |
| 2 | Material | FR4 high tg |
| 3 | PCB thick | 1.65mm |
| 4 | Usage | Telecommunication |
| 5 | Microvia | 0.1mm |
| 6 | Min line track | 0.063mm |
| 7 | Min space | 0.063mm |
| 8 | Surface finish | ENIG 3u'' |
| 9 | Copper weight | 1OZ inner and 2OZ outer |
| 10 | Soldermask | Blue |
| 11 | Blind via | Yes |
| 12 | Buried via | Yes |
| 13 | Pads over via | Yes |
| 14 | blind via resin hole + plating filled | Yes |
| 15 | Certificates | UL,RoHS,ISO9001/14001,SGS,ISO/TS16949 |
FAQ
Q1:What's HDI?
A: High density Interconnect.
Q2:HDI description?
A: PCB with a higher wiring density per unit area than conventional PCB,They have finer line and space<=0.1mm,smaller via(<=0.15mm) and capture pad<=0.4mm, and higher connection paddensity(>20pads/cm2) than conventional one.
Q3:Quality policy?
A: All HDI board test fine then shipment.
Q4: How about delivery?
A: 20 working days production time for HDI PCB.
Q5: Application area?
A: Telecommunication,Control system,Electronics,Lighting and so on.
Q6: What's the important file requirement?
A: Gerber file besides drill chart/layer.
Factory visitor:
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