COB display
LCD displays each require one or more driver modules (s) to control them. These ICs are either placed directly on a circuit board (as COB or SMD) or as COG (Chip-On-Glass) directly on the LC glass. In chip on board technology, the semiconductor chip (driver) is glued directly onto a circuit board material and contacted there via bond wires. For protection, the IC and the bonding wires are sealed with a drop of potting compound using chip-on-board technology. Chip-on-board
LCD displays each require one or more driver modules (s) to control them. These ICs are either placed directly on a circuit board (as COB or SMD) or as COG (Chip-On-Glass) directly on the LC glass. In chip on board technology, the semiconductor chip (driver) is glued directly onto a circuit board material and contacted there via bond wires. For protection, the IC and the bonding wires are sealed with a drop of potting compound using chip-on-board technology. Chip-on-board displays are widespread and cheaper than LCD modules with SMD components.
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