Flatpack Metal Integrating Hermetic Packages Electronics
Main performance parameters Application fields: Optical communication package Lead welding method: tin welding, gold wire bonding Nickel plating thickness: >3μm Gold plating thickness: >0.45μm Hermeticity: Leak rate ≤1x10-3Pa.cm3/s (He) Material: Shell: Kovar Alloy, copper, aluminum, steel, etc. Lead: Kovar alloy, iron-nickel alloy, copper core composite Cover plate: Kovar alloy, iron-nickel alloy, steel Insulator: DM308 or similar, iron-sealed glass beads Sealing process and
Main performance parameters
Application fields: Optical communication package
Lead welding method: tin welding, gold wire bonding
Nickel plating thickness: >3μm
Gold plating thickness: >0.45μm
Hermeticity: Leak rate ≤1x10-3Pa.cm3/s (He)
Material:
Shell: Kovar Alloy, copper, aluminum, steel, etc.
Lead: Kovar alloy, iron-nickel alloy, copper core composite
Cover plate: Kovar alloy, iron-nickel alloy, steel
Insulator: DM308 or similar, iron-sealed glass beads
Sealing process and technology: parallel seam welding, laser welding
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