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Components Hermetically Sealed Electronic Packages

Name: Components Hermetically Sealed Electronic Packages
Brand: JOPTEC LASER CO., LTD

Main performance parameters Application fields: optical communication module package Lead welding method: tin welding, gold wire bonding Nickel plating thickness: >3μm Gold plating thickness: >0.45μm Hermeticity: Leak rate ≤1x10-3Pa.cm3/s (He) Material: Shell: Kovar Alloy, copper, aluminum, steel, etc. Lead: Kovar alloy, iron-nickel alloy, copper core composite Cover plate: Kovar alloy, iron-nickel alloy, steel Insulator: DM308 or similar, iron-sealed glass beads Sealing

Application fields optical communication module package

Place of Origin HEFEI, CHINA

Insulator DM308 or similar, iron-sealed glass beads

Packaging Details Boxes

Gold plating thickness >0.45μm

Supply Ability 5000000 PCS/Month

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Product Description

Material:
Shell: Kovar Alloy, copper, aluminum, steel, etc.
Lead: Kovar alloy, iron-nickel alloy, copper core composite
Cover plate: Kovar alloy, iron-nickel alloy, steel
Insulator: DM308 or similar, iron-sealed glass beads
Sealing process and technology: parallel seam welding, laser welding