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Module Hermetically Sealed Electronic Packages

Name: Module Hermetically Sealed Electronic Packages
Brand: JOPTEC LASER CO., LTD

Main performance parameters Application fields: Optical communication module, pump laser, DCDC power supply, filter, modulator Lead welding method: tin welding, gold wire bonding Nickel layer thickness: >3μm Gold layer thickness:> 0.45μm Hermeticity: leak rate ≤1x10-3Pa.cm3/s (He) Insulation resistance: ≥1000MΩ (DC500V) material: Base: Kovar alloy, iron-nickel alloy, copper Ring frame: Kovar alloy, steel Lead: Kovar alloy, iron-nickel alloy, copper core composite Cover plate:

Application fields Optical communication module

Place of Origin HEFEI, CHINA

Packaging Details Boxes

Insulation resistance ≥1000MΩ (DC500V)

Supply Ability 5000000 PCS/Month

Lead welding method tin welding

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Product Description

Main performance parameters

Application fields: Optical communication module, pump laser, DCDC power supply, filter, modulator
Lead welding method: tin welding, gold wire bonding
Nickel layer thickness: >3μm
Gold layer thickness:> 0.45μm
Hermeticity: leak rate ≤1x10^-3Pa.cm³/s (He)
Insulation resistance: ≥1000MΩ (DC500V)
material:
Base: Kovar alloy, iron-nickel alloy, copper
Ring frame: Kovar alloy, steel
Lead: Kovar alloy, iron-nickel alloy, copper core composite
Cover plate: Kovar alloy, iron-nickel alloy, steel
Insulator: DM308 or similar, iron sealed glass beads, ceramic
Sealing process and technology: parallel seam welding, laser welding, tin sealing welding, stored energy welding