Solid State Pump Diode Hermetically Sealed Packaging
Product name: high power laser package Applications: laser marking, laser cutting, laser welding, medical cosmetology and other fields Product features: Fiber laser pump source package, meet the high heat dissipation requirements of the module, the base material is oxygen-free copper with high thermal conductivity. Technical characteristics : COS mounting surface height difference accuracy: ±0.01mm Flatness: ≤0.05mm Roughness: 0.8um Air tightness : ≤1x10-3Pa.cm3/s(He)
Product name: high power laser package
Applications: laser marking, laser cutting, laser welding, medical cosmetology and other fields
Product features: Fiber laser pump source package, meet the high heat dissipation requirements of the module, the base material is oxygen-free copper with high thermal conductivity.
Technical characteristics :
COS mounting surface height difference accuracy: ±0.01mm
Flatness: ≤0.05mm
Roughness: 0.8um
Air tightness : ≤1x10-3Pa.cm3/s(He)
Insulation resistance: ≥1x1010Ω(500V DC) (glass),
≥1x1010Ω(500V DC) (ceramic)
Salt spray resistance: 24h
Plating quality assessment: N2, 450±10℃, 15min
Temperature cycle: -55℃~125℃, 20cycles
Thermal shock: -55℃~125℃, 20cycles