Photoelectron Semiconductor Molybdenum Sputtering Target
1. Grade: MO1.MO2 2. Purity :> =99.95% 3. Characteristic: Melting Point: 2610°C Boiling Point:5560°C Density: 10.2g/cm3 High quality, workability 4. Certificate: ISO9001:2008 5. Product Feature: High melting point, High-density, high temperature oxidation resistance, long service life, resistance to corrosion.. 6. Specifications: Thickness (mm) Thickness Tolerance Width (mm) Width Tolerance Length (mm) Length Tolerance 0.10~0.30 ±0.01 ≤350 ±2 ≤1300 ±5 0.31~2.00 ±0.05 ≤600 ±5
1. Grade: MO1.MO2
2. Purity :> =99.95%
3. Characteristic:
Melting Point: 2610°C
Boiling Point:5560°C
Density: 10.2g/cm3
High quality, workability
4. Certificate: ISO9001:2008
5. Product Feature: High melting point, High-density, high temperature oxidation resistance, long service life, resistance to corrosion..
6. Specifications:
| Thickness (mm) |
Thickness Tolerance | Width (mm) |
Width Tolerance | Length (mm) |
Length Tolerance |
| 0.10~0.30 | ±0.01 | ≤350 | ±2 | ≤1300 | ±5 |
| 0.31~2.00 | ±0.05 | ≤600 | ±5 | ≤1300 | ±5 |
| 2.01~3.00 | ±0.08 | ≤400 | ±3 | ≤1000 | ±5 |
| 3.01~4.00 | ±0.10 | ≤400 | ±3 | ≤1000 | ±5 |
7. Applications: It is used for fabrication of sintering boats, high temperature furnace heating elements and heat shields. the microelectronic ,flat panel display, data storage, optical glass coating ,and other industries.
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