NSTAR-600 Solder Paste Mixing Machine with 1400/400 RPM Speed Control and Dual 500g Jar Capacity
Industrial solder paste mixing machine featuring dual 500g jar capacity, 1400/400 RPM speed control, and digital timer display. Ensures homogeneous paste consistency, eliminates air bubbles, and prevents moisture absorption for superior PCB assembly results. Includes safety protections and multiple tin pot size options for flexible manufacturing applications.
The NSTAR-600 Solder Paste Mixing Machine efficiently homogenizes solder paste to liquid state with precise speed control and digital operation time display. Designed for industrial PCB assembly, this dual-jar system ensures optimal stencil printing and reflow process results while preventing moisture absorption.
- 45° angled jar placement prevents solder paste adhesion to jar covers
- Dual-jar capacity - mixes two 500g solder paste containers simultaneously
- Dual safety protection ensures operator security during operation
- Air bubble elimination during mixing process for consistent paste quality
- Specialized control circuit for precise mixing parameter management
- Optimized rotation speeds (1400 RPM primary, 400 RPM secondary) prevent tin powder impact
- Water-free operation maintains tin particle integrity and shape
| Model | NSTAR-600 |
| Wattage | 60W |
| Power Supply | AC220V, 50Hz |
| Rotation Speed | Primary: 1400 RPM; Secondary: 400 RPM |
| Working Capacity | 500g × 2 jars simultaneously |
| Tin Pot Sizes | Standard: Φ60-67mm Small: Φ53-60mm (optional) Large: Φ67-74mm (optional) |
| Time Setting | 0.1-9.9 mins (0.1 min increments) 10-30 mins (1.0 min increments) |
| Display & Alert | LED digital display with blinking light and buzzer warning |
| Machine Dimensions | 410 × 410 × 490mm (W × D × H) |
| Packing Dimensions | 420 × 420 × 500mm (W × D × H) |
| Net/Gross Weight | 40kg / 45kg |
Ideal for electronics manufacturing facilities, PCB assembly lines, and SMT production environments requiring consistent solder paste preparation. The machine enhances stencil printing precision and reflow soldering outcomes while reducing manual handling and moisture contamination risks.
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