High Speed Pneumatic Jetting Valve HS-PF-100 200 Aluminum Body 24V Non Contact Dispensing
Non-contact pneumatic jet valve for high speed precision dispensing. Aluminum body, 24V drive, adjustable stroke. Ideal for UV adhesive, silver paste, epoxy. Compact design, easy maintenance. Custom options available.
High-Speed Controlled Volume Aluminum Valve Body Material Jetting Valve HS-PF-100 HS-PF-200
Principle & Control
Contactless Pneumatic Jet Valves
1.High-speed jet valve is a high speed non-contact jet valve driven by pneumatic pressure and controlled by solenoid valve, breaking through the traditional contact dispensing technology, no need to move the Z-axis when working, the spring pressure in the cavity is adjustable pneumatic pressure is used to drive, non-contact jet dispensing, high precision, fast speed solenoid valve control, fine scale micrometer to adjust the stroke, the spring pressure in the cavity is adjustable air-cooled way of physical cooling and cooling of the valve, which greatly improves the performance and life of the valve. Improve the performance and life of the valve.
2.Compact exterior design, flexible equipment installation, fast maintenance and servicing.
Specification
| Model | HS-PF-100/200 |
| Drive Voltage | 24V |
| Minimum Drive Air Voltage | 0.6-0.8mPa (90Psi) |
| Barrel Air Pressure | 0-0.4mPa (50Psi) |
| Valve Body Material | Aluminum |
| Fluid groove material | SUS304 |
| Piston seal | PTFE synthetic material |
| Needle Seal | PEK/PTFE/PE optional |
| Needle Material | Super Carbide |
| Nozzle Material | Super Carbide |
| Body Temperature | ≤100℃ |
| Nozzle Temperature | Room temperature～130°C |
| Dimension | 24×90×160mm |
| Body weight | 0.55kg |
| Applicable liquid |
High-speed and controlled volume dispensing of a wide range of fluids and adhesives, such as bottom filler, UV adhesive, silver paste, silicone, epoxy adhesive, surface coating adhesive, surface mount adhesive and so on. |
Application Field
Camera Module Bonding, Sensor Control Unit Bonding and Potting, Flexible Board Bonding, Main Board Underfill, Bezel Bonding, Fingerprint Key Module Bonding, Sensor Control Unit Bonding, Power Supply Potting.
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