Wafer dicing blade

Wafer dicing blade Main cutting products: Silicon wafers, semiconductor compound wafers (GaAs, GaP, etc.), oxide wafers (LiTaO3, etc.), chip LED substrates, various semiconductor packaging components Electroplated nickel blade Main cutting products: silicon wafers, semiconductor compound wafers (GaAs, GaP, etc.), various semiconductor packaging components, various semiconductor packaging components of other materials, unsintered ceramics, brittle and hard materials, other