China Microcomputer Control Programmable Thermal Shock Chamber for sale
China Microcomputer Control Programmable Thermal Shock Chamber for sale
China Microcomputer Control Programmable Thermal Shock Chamber for sale
China Microcomputer Control Programmable Thermal Shock Chamber for sale
China Microcomputer Control Programmable Thermal Shock Chamber for sale

Microcomputer Control Programmable Thermal Shock Chamber

\n\nMicrocomputer Control Programmable Thermal Shock Chamber \n\nProduct Overview \nProgrammable Thermal Cycling Test Hot and Cold Thermal Shock Chamber designed for testing material changes under extreme temperature environments that alternate continuously in the shortest time. This equipment tests chemical changes or physical damage caused by thermal expansion and contraction. \nThe testing chamber is divided into two parts: high-temperature region and low-temperature

Place of Origin China
Outside size 140cm(W)*180cm(H)*142cm(D)
Packaging Details Programmable Thermal Cycling Test Hot and Cold Thermal Shock Chamber is packaged within wooden case.
Model Number ZL-6012
Inside material SUS#304 Cold-Heat-resistant stainless steel
Supply Ability 60 Sets
Product Description

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Microcomputer Control Programmable Thermal Shock Chamber
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Product Overview
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Programmable Thermal Cycling Test Hot and Cold Thermal Shock Chamber designed for testing material changes under extreme temperature environments that alternate continuously in the shortest time. This equipment tests chemical changes or physical damage caused by thermal expansion and contraction.

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The testing chamber is divided into two parts: high-temperature region and low-temperature region. Testing samples are placed on a moving basket that moves up and down between hot and cold regions using unique heat storage and cool storage technology to complete thermal shock testing.

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Applied to test various materials including metal, plastic, rubber, electronics, and other materials. Results can be used as a basis for product improvement.

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View Environmental Test Chamber Details

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Primary Applications
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For electrical and electronic components, automation components, communication components, auto parts, metals, chemical materials, plastics industries, defense, aerospace, industrial industry, BGA, PCB base plates, electronic chips, ICs, semiconductor ceramics, and high-molecular materials.

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Tests material response to high and low temperature tension and repeated thermal expansion/contraction cycles. Confirms product quality from precision IC components to heavy machinery applications.

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Key Features
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  • Large color LCD touch interactive microcomputer control system, easy to understand operation
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  • Closed imported compressor + environmental refrigerant, cold plate heat exchanger and dual-type ultra-low temperature refrigeration systems
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  • LAN network communication interfaces for computer remote control
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  • Independent setting for heat, cold, and hot/cold conditions with three different function impacts
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  • Automatic pre-cooling, preheating, and standby functions during operation
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  • Configurable defrost cycles with automatic (manual) defrost capability
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  • User-friendly controller interface with comprehensive troubleshooting display
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Compliance Standards
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  • GB/T2423.1-1989 low-temperature testing method
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  • GB/T2423.2-1989 high-temperature testing method
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  • GB/T2423.22-1989 change temperature test
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  • GJB150.5-86 temperature impact test
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  • GJB360.7-87 temperature impact test
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  • GJB367.2-87 405 temperature impact test
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  • GB/T2423.1-2008 test A, GB/T2423.2-2008 test B
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  • GB-T10592-2008, GJB150.3-198, GJB360A-96 method 107 temperature shock test requirements
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Technical Specifications
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ModelZL-6012A
Temperature RangeA. High-temperature: +60\u2103\uff5e+150\u2103 (customizable)
B. Low-temperature: -10\u2103\uff5e-40\u2103
Control Temperature\u00b12\u2103
Resolution0.01\u2103
Heating Time (High-temperature)RT\uff5e\uff0b150\u2103 approximately 35min (RT from \uff0b5\uff5e\uff0b30\u2103)
Cooling Time (Low-temperature)RT\uff5e-40\u2103 approximately 50min (RT from \uff0b5\uff5e\uff0b30\u2103)
Moving & Recovery TimeA. Basket movement (high to low): 10 seconds
B. Temperature recovery: 3-5 minutes (Stabilization \u2265 30 minutes)
Device NoiseBelow 75dB
Weight10Kg
Testing Region50cm(W) \u00d7 50cm(H) \u00d7 50cm(D)
Outside Dimensions140cm(W) \u00d7 180cm(H) \u00d7 142cm(D)
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\n\nMicrocomputer Control Programmable Thermal Shock Chamber - Industrial testing equipment for thermal cycling and shock testing\n\n
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