IC High Image Resolution Unicomp Weld X Ray Inspection Machine Microfocus

Name: IC High Image Resolution Unicomp Weld X Ray Inspection Machine Microfocus
Brand: Unicomp Technology

Unicomp--China Lead X-Ray Manufacturer'S Microfocus X-Ray With High Image Resolution For IC PCBA Soldering Inspection Features: ● 1000X magnification, high-definition real-time image. ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● One-button operation with 2.5D image display. ● Off-line programming function, navigation mode detection. ● 7 axis linkage, 70 degree tilt detection. Applications: ● SMT, BGA, CSP, Flip Chip, LED Detection. ●

Place of Origin China

Size 1350(L)x1250(W)x1700(H)mm

Packaging Details Wooden Case, Waterproof, Anti-collision

Model Number AX9100

Supply Ability 300 sets per month

Certification CE, FDA

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Product Description

Unicomp--China Lead X-Ray Manufacturer'S Microfocus X-Ray With High Image Resolution For IC PCBA Soldering Inspection

Features:

● 1000X magnification, high-definition real-time image.
● 90-130KV 7μm X-Ray tube.
● High speed & Millions pixels high resolution FPD.

● One-button operation with 2.5D image display.
● Off-line programming function, navigation mode detection.
● 7 axis linkage, 70 degree tilt detection.

Applications:

● SMT, BGA, CSP, Flip Chip, LED Detection.
● Semiconductor, Packaging components, Battery Industry.
● Electronic components, Auto parts, Photovoltaic Industry.
● Aluminum Die-casting, Moulding Plastic.
● Ceramics, Other Special Industries.

Item	Definition	Specs
System Parameters	Size	1350(L)x1250(W)x1700(H)mm
	Weight	1900kg
	Power	220AC/50Hz
	Power Consumption	1.6kW
X-ray Tube	Type	Closed
	Max.Voltage	130kV
	Max.Power	40W
	Spot Size	7μm
X-ray System	Intensifier	FPD
	Monitor	22 ‘’LCD
	System Magnification	1600 X
Detection Region	Max.Loading Size	Φ570mm
Detection Region	Max.Inspection Area	450mm x 450mm
X-ray Leakage		<1μSv/h