Unicomp AX9100max X-ray Machine For Cylindrical Cell
Unicomp AX9100max X-ray Machine For Cylindrical Cell Widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, and Photovoltaic Industry. Application Fields Functions and Features Inspection Image Technical Parameters and Specifications Dimensions and Appearance
Place of Origin
China
Machine Weight
≈2400kg
Focus Spot Size
≤7um
Packaging Details
Unicomp Wood.
Pixel Size
≤84um
Power supply
220AC/50Hz
Product Description
Unicomp AX9100max X-ray Machine For Cylindrical Cell
Widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, and Photovoltaic Industry.
Application Fields
Functions and Features
Inspection Image
Technical Parameters and Specifications
Dimensions and Appearance
Recommended Products
Price: can negotiate
Price: can negotiate
Price: can negotiate
Price: can negotiate
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