Consumer Electronics PCB Prototype High Complexity Multilayers RoHS Certificated
High complexity PCB Prototype 1-18 layers Multilayers PCB RoHS 94v0 PCB Cu Thickness + Plating Out Layer Cu Thickness 1 - 6OZ Inner Layer Cu Thickness 0.5 - 4OZ Cu Thickness of PTH 20UM ≤ Average ≤ 25UM Min: 18UM HASL with Lead Tin 63% Lead 37% HASL Free Lead 7UM ≤ Surface Thickness ≤ 12UM Thick Gold Plating Ni Thickness: 3 - 5UM ( 120u" - 200u" ) Gold Thickness: 0.025 - 1.27UM ( 1u" - 50u" ) Immersion Gold Ni Thckness: 3 - 5UM ( 120u" - 200u" ) Gold Thickness: 0.02
High complexity PCB Prototype 1-18 layers Multilayers PCB RoHS 94v0
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PCB Cu Thickness + Plating |
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Out Layer Cu Thickness |
1 - 6OZ |
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Inner Layer Cu Thickness |
0.5 - 4OZ |
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Cu Thickness of PTH |
20UM ≤ Average ≤ 25UM |
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Min: 18UM |
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HASL with Lead |
Tin 63% Lead 37% |
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HASL Free Lead |
7UM ≤ Surface Thickness ≤ 12UM |
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Thick Gold Plating |
Ni Thickness: 3 - 5UM ( 120u" - 200u" ) |
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Gold Thickness: 0.025 - 1.27UM ( 1u" - 50u" ) |
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Immersion Gold |
Ni Thckness: 3 - 5UM ( 120u" - 200u" ) |
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Gold Thickness: 0.025 - 0.15UM ( 1u" - 3u" ) |
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Immersion Silver |
Ag Thickness: 0.15- 0.75 UM ( 6u" - 30u" ) |
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Gold Finger |
Ni Thickness: 3 - 5UM ( 120u" - 160u" ) |
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Gold Thickness: 0.025 - 1.51UM ( 1u" - 60u" ) |
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U940 PCB Pattern Limit Capability |
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Min Width |
0.075MM ( 3 mil ) |
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Min Trace |
0.075MM ( 3 mil ) |
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Min Width of Ring ( Inner Layer ) |
0.15MM ( 6 mil ) |
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Min Width of Ring ( Out Layer ) |
0.1MM ( 4 mil ) |
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Min Solder Bridge |
0.1MM ( 4 mil ) |
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Min Height of Legend |
0.7MM ( 28 mil ) |
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Min Width of Legend |
0.15MM ( 6 mil ) |
Reference - Our Production Capability for Rigid PCB
1) Layer: 1-18 Layers
2) Board finished thickness: 0.21mm-7.0mm
3) Material: FR-4, CEM-1,CEM-3, High TG, FR4 Halogen Free,Rogers
4) Max. finished board size: 23 × 25 ( 580mm×900mm )
5) Min. drilled hole size: 3mil (0.075mm)
6) Min. Line width: 3mil (0.075mm)
Min.Line spacing:3mil (0.075mm)
7) Surface finish/treatment : HASL / HASL lead free,HAL, Chemical tin,Chemical Gold, Immersion Silver/Gold,OSP,Gold plating
8) Copper thickness: 0.5-7.0 OZ
9) Solder mask color: green/yellow/black/white/red/blue
10) Copper thickness in hole: >25.0 um (>1mil)
11)Inner packing: Vacuum packing / Plastic bag
Outer packing: Standard carton packing
12) Shape tolerance: ±0.13
Hole tolerance: PTH: ±0.076 NPTH: ±0.05
13) Certificate: UL, ISO 9001, ISO 14001
14) Special requirements: Buried and blind vias+controlled impedance +BGA
15) Profiling: Punching, Routing, V-CUT, Beveling
16) Provides OEM services to all sorts of printed circuit board assembly as well as electronic encased products
PCB Capacity
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Item
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Capability---Technology
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Standard
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IPC-A-610 E Class II-III
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Laminate/Base Material
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FR-4 / PI (FPC) / High TG FR-4 / Halogen Free material/Rogers/Arlon/
Taconic/Teflon/CEM-3/PTFE/Aluminum /BT
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Layers
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1-18
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Finised inner/outer copper thickness
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1-6 OZ
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Board Thinkness
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0.2-5.0mm
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Min hole size
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Mechanical hole: 0.15mm
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Laser hole: 0.1mm
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Min line width/space
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0.075mm/0.075mm
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Min line Gap
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+/-10%
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Aspect Ratio
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12:1
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Controlled Impedance
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<= +/-10%
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Solder Mask Color
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Green,Blue,Black,White,Yellow,Red,Grey,Purple etc..
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Outline profile
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Rout/ V-cut/ Bridge/ Stamp hole
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Surface treatment
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HASL, HASL lead free, Immersion Gold,ENEPIG, Immersion Tin, Immersion Silver, Hard gold, Flash gold, OSP...
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Tolerance of dimension size
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+/-0.1mm
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Capacity
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35000sq/Month
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CAM Capability
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40 item
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PCB Photos
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