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China Multilayer SMT PCB Assembly Prototype Printed Circuit Board 2 Years Guarantee for sale

Multilayer SMT PCB Assembly Prototype Printed Circuit Board 2 Years Guarantee

Name: Multilayer SMT PCB Assembly Prototype Printed Circuit Board 2 Years Guarantee
Brand: Shenzhen Shinelink Technology Ltd

SMT Components Multilayer PCB Assembly Prototype Printed Circuit Board LEAD TIME FOR PRODUCTION ORDERS Sample Lead timeMass production lead timeSingle sided PCB1~34~7Double sided PCB2~57~10Multilayer PCB7~810~15PCB and Assembly8~1515~20 Features 1. One Stop OEM Service: Made in Shenzhen of China2. Manufactured by Gerber File and Bom LIst Offered by Customers3. SMT, DIP Technology Support4. FR4 Material Meet 94v0 Standard5. UL,CE,ROHS Compliant6. Standard Lead Time: 4-5days

Place of Origin China

Features 3 Quality 2 years guarantee

Packaging Details ESD package

Model Number SL81023S006

Supply Ability 100000pcs per day

Certification UL,RoHS, CE

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Product Description

SMT Components Multilayer PCB Assembly Prototype Printed Circuit Board

LEAD TIME FOR PRODUCTION ORDERS

	Sample Lead time	Mass production lead time
Single sided PCB	1~3	4~7
Double sided PCB	2~5	7~10
Multilayer PCB	7~8	10~15
PCB and Assembly	8~15	15~20

Features

1. One Stop OEM Service: Made in Shenzhen of China
2. Manufactured by Gerber File and Bom LIst Offered by Customers
3. SMT, DIP Technology Support
4. FR4 Material Meet 94v0 Standard
5. UL,CE,ROHS Compliant
6. Standard Lead Time: 4-5days for 2L;5-7 for 4L. Expedited Service is available

PCB Assembly Capability

Stencil Size	736x736mm
Minimum IC Pitch	0.2mm
Maximum PCB size	1200x 500mm
Minimum PCB thickness	0.25mm
Minimum chip size:	0201 (0.2x0.1)/0603 (0.6 x 0.3mm)
Maximum BGA size:	74x74mm
BGA ball pitch:	1.00mm (minimum), 3.00mm (maximum)
BGA ball diameter:	0.40mm (minimum), 1.00mm (maximum)
QFP lead pitch:	0.38mm (minimum), 2.54mm (maximum)
Volume:	One piece to low volume production quantities Low cost first article builds Schedule deliveries
Assembly type:	Surface mount(SMT) assembly DIP assembly Mixed(surface mount and through hole) technology Single or double sided placement Cable assembly
Components type:	Passive components: As small as 0402 package As small as 0201 with design review Ball Grid Arrays(BGA): As small as .5mm pitch
Parts procurements:	Turnkey(we supply the parts) Consigned(you supply the parts) You supply some parts, we do the rest
Solder type:	Leaded Lead-free/ROHS compliant
Other capabilities:	Repair/rework services Mechanical assembly Box build Mold and plastic injection.