Fiber Laser Cutting Machine
Scribing and cutting for mono-crystalline silicon, poly-crystalline silicon, amorphous-crystalline silicon, solar cell, Silicon, germanium and Gallium arsenic semiconductor materials. Technical Parameters: Modulated frequency: 20- 80 kHz Beam power: Adjustable, max 20W Scribing speed: Adjustable, max 200 mm/ s Min scribing line width: 0.05 mm Scribing area: 156mm × 156mm,125mm × 125mm, CNC worktable accuracy: 0.01 mm Power supply: 1-phase 220 VAC +/- 10%, 50 Hz (A voltage
Scribing and cutting for mono-crystalline silicon, poly-crystalline silicon, amorphous-crystalline silicon, solar cell, Silicon, germanium and Gallium arsenic semiconductor materials.
Technical Parameters:
Modulated frequency: 20- 80 kHz
Beam power: Adjustable, max 20W
Scribing speed: Adjustable, max 200 mm/ s
Min scribing line width: 0.05 mm
Scribing area: 156mm × 156mm,125mm × 125mm,
CNC worktable accuracy: 0.01 mm
Power supply: 1-phase 220 VAC +/- 10%, 50 Hz (A voltage stabilizer might
be required to avoid irregular scribing quality caused by severe voltage fluctuation).
Input power: Max 1.5kW
The 20 W fiber laser with optics isolation system has high stability and good scribing quality, better than traditional lamp-pumped laser. Its 1,064 nm laser wavelength could scribe on silicon wafer/ solar cell/ ceramic wafer/ thin metal sheet.
● Great laser quality/ reliability
● Very Low operation cost
● Maintenance-free
● Compact design
● Easy operation and professional software