Microelectronic Package

Microelectronic Package Product Description Computer CPU,DSC chips Integrated Circuit Package Housings Carriers Radar Microwave modules Semiconductor Wafers Electronic Communications Devices Materials:Silicon Aluminum Alloys(AlSi Alloys) Configuration:Platforms,Plug-ins,Flatpacks,TO Headers etc. Advantages CTE match to circuit boards and components; High thermal conductivity and outstanding heat dissipation; Low density; Hermeticity; Dimensional stability; Corrosion