Chemicals Adhesives & Sealants

China TIE 380-25 One Component Epoxy Thermal Conductive Adhesive 2.5 W/m·K with 140,000 cPs Viscosity for Industrial Applications for sale

TIE 380-25 One Component Epoxy Thermal Conductive Adhesive 2.5 W/m·K with 140,000 cPs Viscosity for Industrial Applications

Name: TIE 380-25 One Component Epoxy Thermal Conductive Adhesive 2.5 W/m·K with 140,000 cPs Viscosity for Industrial Applications
Brand: Dongguan Ziitek Electronical Material and Technology Co., Ltd

High-performance one-component epoxy adhesive with 2.5 W/m·K thermal conductivity and 140,000 cPs viscosity. Features excellent bond strength, thermal shock resistance, and compatibility with metals and ceramics. Ideal for high-speed production lines with stencil printing capability and fast heat curing from 100°C to 170°C.

Place of Origin China

Packaging Details 1kg/can

Hardness 92 Shore A

Thermal Conductivity 2.5 W/m-K

Model Number TIE380-25

Supply Ability 100KG/Day

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Product Description

Product Overview

TIE™380-25 is a high-performance, one-component epoxy thermal conductive adhesive designed for industrial applications requiring efficient heat dissipation and strong bonding capabilities.

Key Features

Excellent thermal conductivity: 2.5 W/m·K
Superior adhesion performance and maneuverability
Low shrinkage during curing process
Low viscosity for easy application and reduced gas emissions
Excellent solvent and water resistance
Extended working time for complex assemblies
Outstanding resistance to thermal shock

Technical Specifications

Property	Value	Test Method
Chemical Type	Epoxy	-
Appearance (Uncured)	Gray Paste	Visual
Appearance (Cured)	Dull Gray Solid	Visual
Components	One Component	-
Heat Capacity	0.7 J/g·K	ASTM C351
Key Substrates	Metals, Ceramics	-
Hardness	92 Shore A	ASTM 2240
Continuous Use Temperature	-40 to 180°C	-
Tensile Strength (Al/Al @25°C)	>2800 psi	-
Thermal Conductivity	2.5 W/m·K	ASTM D5470