8KW CCD Automatic Align Semiconductor Wafer Cutting Machine
Automatic Semiconductor Wafer Cutting Machine For PCB, IR Filter, Sapphire Glass And Ceramic Features of products • Using touching LCD to operate. The interface design is simple and easy. Provide a variety of languages such as Chinese,English, Korean, etc. • Feeding, position align, cutting, cleaning / drying and unloading all automatically completed. • Can meet the high precision cutting maximum diameter of 300 mm materials. • Double spindle cutting simultaneously, more than
Dimensions of processing
Φ300mm
Place of Origin
China Dongguan
Cutting water consumption
6.5L/min
Packaging Details
plywooden case
（W×D×H） physical dimension
1262×1704×2023mm
Air consumption
250L/min
Product Description
Automatic Semiconductor Wafer Cutting Machine For PCB, IR Filter, Sapphire Glass And Ceramic
Features of products
• Using touching LCD to operate. The interface design is simple and easy. Provide a variety of languages such as Chinese,English, Korean, etc.
• Feeding, position align, cutting, cleaning / drying and unloading all automatically completed.
• Can meet the high precision cutting maximum diameter of 300 mm materials.
• Double spindle cutting simultaneously, more than 85% higher than that of single spindle cutting capacity.
• CCD automatic align.
• Real-time monitoring system of the pressure, water pressure, current, etc., to avoid damage to the air spindle.
• Dicing spindle: 2.4 kw × 2set (Max: 60,000 rpm)
• Repeat positioning accuracy : 0.001mm
• Cutting speed: 0.05 ~ 400 mm/sec
• Each magazine can be stored 20 ~ 30 layers of frame.
• Standard collocation of using blade size: 2 Inch(Max:3 Inch)
Specs:
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x-axis
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Working stroke
|
500mm
|
|
cutting speed
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0.05 ~ 400mm/sec
|
|
|
resolution
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0.0001mm | |
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y-axis
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Working stroke
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650mm
|
|
resolution
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0.0001mm
|
|
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Repeat positioning accuracy
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0.001 / 310mm
|
|
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z-axis
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Working stroke
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60 (2 Inch blades)mm
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resolution
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0.0001m
|
|
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Θ-axis
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Angle of rotation
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360deg |
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Dimensions of processing
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Φ300mm
|
|
Dimensions of working platform
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Φ350
|
|
power
|
2.4×2 set KW
|
|
speed
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5,000 ~ 60,000 rpm
|
|
power supply
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3P , 220 (50 ~ 60 Hz) V
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|
machine power
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8KW |
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Power air pressure
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0.6 ~ 0.68MPa
|
|
Air consumption
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250L/min |
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Cutting water consumption
|
6.5L/min |
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cooling water consumption
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2.5L/min |
|
(W×D×H) physical dimension
|
1262×1704×2023
|
|
machine net weight
|
1000KG |
Process description
1.Mechanism remove it from magazine,and send it to the temporary table.
2.Unloading robot will move the dicing material to chunk. for dicing process.
3.Feeding robot move the dicing material to the cleaning platform for cleaning and drying process.
4.Unloading robot send material having been cleaned and dried to the temporary table.
5.Robot send the dicing material to the magazine .
Optional equipment
1,Function of blade damage detection;
2,Automatic setting function;
3,Dicing visual function;
4, Using dicing blade with 3 Inch.
Case Sharing
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