Machinery Industry Laser Equipment Laser Cutting Machines

Simple Operation Laser Depaneling Machine High Precision CCD Automatic Positioning

Name: Simple Operation Laser Depaneling Machine High Precision CCD Automatic Positioning
Brand: YUSH Electronic Technology Co.,Ltd

Laser PCB Separator with ±20 μm Precision for FR4 PCB Boards 450*430 Mm 15W UV PCB Separator / FR4 Board Laser Depaneling Machine ±20 μM Precision PCB Separator / FR4 Board Laser PCB Depaneling Machine ±20 μM Precision The laser process is completely software-controlled. Varying materials or cutting contours are easily taken into account through adapting the processing parameters and laser paths. In the case of laser cutting with the UV laser, no appreciable mechanical or

Working Size: 450*430 Mm

Precision: ±20 μm

Place of Origin Jiangsu

Packaging Details Wooden case

Laser Brand: USA Or Germany

Model Number YSATM-3L

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Product Description

Laser PCB Separator with ±20 μm Precision for FR4 PCB Boards

450*430 Mm 15W UV PCB Separator / FR4 Board Laser Depaneling Machine ±20 μM Precision

PCB Separator / FR4 Board Laser PCB Depaneling Machine ±20 μM Precision

The laser process is completely software-controlled. Varying materials or cutting contours are easily taken into account through adapting the processing parameters and laser paths.
In the case of laser cutting with the UV laser, no appreciable mechanical or thermal stresses occur.
The laser beam merely requires a few µm as a cutting channel. More components can thus be placed on a panel.
The system software differentiates between operation in production and setting up processes. That clearly reduces instances of faulty operation.
The fiducial recognition by the integrated vision system is done in the latest version around 100% faster than before.

Laser Depanelizer Machine,YSATM-3L Feature:

1. High precision CCD automatic positioning, automatic focusing. Fast and accurate positioning, save time and no worries.

2. Friendly interface,Simple operation, easy to use, free application; Small size, Save more space; rigorous security design;

3. Reduce energy consumption, Cost savings.

4. Cost-effective, fast cutting speed, stable performance

Laser Depanelizer Machine, YSATM-3L Specification:

Parameter
Technical parameters	Main body of laser	1480mm1360mm1412 mm
	Weight of the	1500Kg
	Power	AC220 V
	Laser	355 nm
	Laser	Optowave 10W(US)
	Material	≤1.2 mm
	Precisio	±20 μm
	Platfor	±2 μm
	Platform	±2 μm
	Working area	600*450 mm
	Maximum	3 KW
	Vibrating	CTI(US)
	Power	AC220 V
	Diameter	20±5 μm
	Ambient	20±2 ℃
	Ambient	＜60 %
	The Machine	Marble