China SMT Stencil Fiber Laser Cutting Machine for Solder Paste Printer for sale
China SMT Stencil Fiber Laser Cutting Machine for Solder Paste Printer for sale
China SMT Stencil Fiber Laser Cutting Machine for Solder Paste Printer for sale
China SMT Stencil Fiber Laser Cutting Machine for Solder Paste Printer for sale
China SMT Stencil Fiber Laser Cutting Machine for Solder Paste Printer for sale
China SMT Stencil Fiber Laser Cutting Machine for Solder Paste Printer for sale

SMT Stencil Fiber Laser Cutting Machine for Solder Paste Printer

YS-GW50 SMT stencil laser cutter delivers ±2μ precision at 24,000 pads/hour. Features innovative waste collection, high-power fiber laser, and custom process solutions for manufacturing plants. 1-year warranty with full certifications.

Place of Origin Jiangsu, China
Positioning accuracy ±2μ
Location detection variability 0.1μm
Cutting thickness ≤0.5mm
Core components PLC, Engine, Bearing, Gearbox, Motor
Focus diameter 25-30μm
Product Description
SMT Stencil Fiber Laser Cutting Machine for Solder Paste Printer
The YS-GW50 SMT Stencil Fiber Laser Cutting Machine from YUSHElectronic Technology Co., Ltd. is a high-performance solution for solder paste printer applications. This advanced cutting system combines precision engineering with innovative waste management for optimal performance in electronic manufacturing environments.
YS-GW50 SMT Stencil Fiber Laser Cutting Machine overview
Key Features and Benefits
Advanced Waste Collection System: Innovative structure design with comprehensive waste and smoke collection that eliminates equipment stability issues caused by chips, slag, and iron dust, significantly extending equipment service life.
High Power Fiber Laser Technology: Semiconductor-pumped solid-state high-power fiber laser increases cutting efficiency and expands the range of machinable products, handling both ordinary metal sheets and precision parts with various thickness requirements.
Specialized Process Solutions: Professional fixture design accommodates materials of various sizes and shapes, optimizing user processes and maximizing equipment value through a complete equipment process system.
YS-GW50 technical specifications and cutting performance
Technical Specifications
Positioning Accuracy ±3μm
Platform Repeatability ±1.5μm
Platform Velocity ≤300mm/S
Location Detection Sub Variability 0.1μm
Cutting Range X 600mm × Y 600mm
Table Size X 620mm × Y 620mm
Cutting Thickness ≤0.5mm (reference value)
Focus Diameter 25-30μm
Best Cutting Effectiveness Up to 9400 Synthetic Aperture/hr, 13000-14000 standard aperture/hour (with 0.3mm diameter standard round date, 0.15mm less steel)
Physical Dimensions: 1680 × 1500 × 1630mm | Weight: 1200KG
YS-GW50 laser cutting machine in operation
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