High Efficiency Wave Soldering Machine N250

Name: High Efficiency Wave Soldering Machine N250
Brand: YUSH Electronic Technology Co.,Ltd

High Efficiency Wave Soldering Machine N250 Product Overview Automatic conveying power system with auto synchronous board feeding functions Tin stove peak uses frequency conversing speed adjustment for independent wave height control Flux spray system with scanning spray nozzle, Japanese nozzles, rodless pneumatic cylinders, and PLC control for accuracy and reliability PLC-controlled operation ensures system reliability and stability Remote infrared ceramic heating pipe

Solder pot capacity 220KG

Convey speed 0-1800mm/min

Place of Origin Guangdong

Solder power 380V 6KW

Wave crest drive power 500W 220V

Model Number Yush N250

swimsuit high waist bikini bottom high waist high speed micro centrifuge

Product Description

High Efficiency Wave Soldering Machine N250

Product Overview

Automatic conveying power system with auto synchronous board feeding functions
Tin stove peak uses frequency conversing speed adjustment for independent wave height control
Flux spray system with scanning spray nozzle, Japanese nozzles, rodless pneumatic cylinders, and PLC control for accuracy and reliability
PLC-controlled operation ensures system reliability and stability
Remote infrared ceramic heating pipe preheating device for direct heat radiation to circuit board bottom
Special alloy transportation chain claws with non-stick tin properties
Tin stove uses imported high frequency conversion motor for independent control and stable performance
Lead-free solder furnace with independent design for environmental protection, safety, and easy cleaning
Three-zone independent temperature control preheating system with excellent heat preservation
Programmable timer functions with 90-minute heating capability
Automatic claw cleaning function for maintaining cleanliness
Sensitive fault security alarm system for stable performance and operator safety

High Efficiency Wave Soldering Machine N250 - Industrial PCB assembly equipment

Technical Specifications

Parameter	Specification
Body Size	1800(L) × 1200(W) × 1600(H) mm
Outside Dimension	2500(L) × 1200(W) × 1600(H) mm
Weight	700 kg
Total/Running Power	11 kW / 4-6 kW
Control Method	Press key + PLC (Optional: touch screen, PC)
Temperature Control Range	Room temperature - 300°C
Preheating Time	Approximately 10-15 minutes for 150°C setting
Solder Type	Lead-free / Sn-Pb