High Efficiency 300W LED Lighting Engine 8000K Multi Chip CSP LED Module
High Efficiency 300W LED Lighting Engine 8000K Multi Chip CSP LED Module Features: 1, Small LES,High Flux Density White LED Emitters; 2, Eutectic-bonding, CSP packaging tecnology 3, Aluminium Nitride(AIN) Ceramic substrate, high thermal conductivity; 4, High light efficiency, long lumen mantenance Specifications: Absolute Maximum Ratings at Ta=85℃ Parameter Symbol MAX. Unit LED Junction Temperature Tj 150 ℃ Power Dissipation PD 300 W Continuous Forward Current IF 10 A ESD ESD
High Efficiency 300W LED Lighting Engine 8000K Multi Chip CSP LED Module
Features:
1, Small LES,High Flux Density White LED Emitters;
2, Eutectic-bonding, CSP packaging tecnology
3, Aluminium Nitride(AIN) Ceramic substrate, high thermal conductivity;
4, High light efficiency, long lumen mantenance
Specifications:
Absolute Maximum Ratings at Ta=85℃
| Parameter | Symbol | MAX. | Unit |
| LED Junction Temperature | Tj | 150 | ℃ |
| Power Dissipation | PD | 300 | W |
| Continuous Forward Current | IF | 10 | A |
| ESD | ESD | 2000 | V |
Characteristics at If=10A (Ta=85°C):
| Parameter | Symbol | Values | Units | ||
| Min. | Typical | Max. | |||
| Luminous Flux | φV | 20000 | 22500 | - | lm |
| Viewing Angle at 50﹪IV | 2θ1/2 | - | 115 | - | Deg. |
| Forward Voltage | VF | 28 | 30 | 32 | V |
| Correlated Colour Temperature | CCT | 6000 | 7000 | 8000 | K |
Applications:
- Architectural lighting
- Medical illumination
- Event lighting
- Fiber Coupled Illumination
- Entertainment Wash Lighting
- Automotive Forward Lighting
Dimensions:
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