HDI FR-1 FR4 High-tg PCB

High Density HDI FR-1 FR4 High-tg PCB Quick Turn PCB Prototypes Silkscreen PRODUCT’S DETAILS Raw Material FR-4(Tg 180) Layer Count 6-Layer Board Thickness 2.0mm Copper Thickness 2.0oz Surface Finish ENIG Solder Mask Green Silkscreen White Min. Trace Width/Spacing 0.075/0.075mm Min. Hole Size 0.25mm Hole Wall Copper Thickness ≥20μm Measurement 300×400mm Packaging Inner: Vacuum-packed in soft plastic bales Outer: Cardboard Cartons with double straps Application Communication