Copper Clad ENIG Multi Layer PCB

Aluminum Solder Mask Multi Layer PCB ENIG Surface Finish , 4 Layer PCB PRODUCT’S DETAILS Raw Material FR-4 (Tg 180 available) Layer Count 4-Layer Board Thickness 1.6mm Copper Thickness 2.0oz Surface Finish ENIG Solder Mask Green Silkscreen White Min. Trace Width/Spacing 0.075/0.075mm Min. Hole Size 0.25mm Hole Wall Copper Thickness ≥20μm Measurement 300×400mm Packaging Inner: Vacuum-packed in soft plastic bales Outer: Cardboard Cartons with double straps Application