600V / 400A Molding IGBT Inverter Module Isolated Copper Baseplate

Isolated Copper Baseplate Using Dbc Technology IGBT Inverter Module Low Switching Losses​ Low Inductance Case Quick Detail: Molding Type Module 600V/400A 2 in one-package for the applications such as UPS and SMPS Description: Low VCE(sat)trench IGBT technology 5μs short circuit capability Low inductance case VCE(sat)with positive temperature coefficient Isolated copper baseplate using DBC technology Maximum junction temperature 175℃ Low switching losses Fast & soft reverse