Width 29mm Hot Melt Adhesive Tape White Translucent For Smart Cards Chip / Substrate
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...29mm Use for Smart Cards Chip and Substrate Hot Melt Adhesive Tape DS-4 Physical Characteristics: Color Transparent Release liner Glassine release paper Density 1.12±0.02g/cm³ Conventional Thickness 55±5μm Melting point 100-110℃ Conventional Width 29mm Melt Flow Index 110±15g/10min ; Condition: ASTM D1238-04 Conventional Length 200m Finished Products Specification 55UM*29MM......
Shenzhen Tunsing Plastic Products Co., Ltd.
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IC Chip Substrate Fabrication with BT(MGC/Hitachi) ENIG/Soft gold/ENEPIG
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Application:IC substrate package,Wifi module/Bluetooth module,Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package;IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate ......
HongRuiXing (Hubei) Electronics Co.,Ltd.
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Sapphire Substrate 180LM 3000K G4 G9 2.3W Led Bulb
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...Substrate 180LM 3000K G4 G9 2.3W Led Bulb Color Clear Finish Finished Power Source Corded-electric Voltage 120 Volts Wattage 2.3 watts Item Package Quantity 1 Type of Bulb Led Measurement System English/Standard G9 2W LED BULB Quick Detail: FULL GLASS AC220-240V input options Transparent Sapphire Substrate Sanan chip......
Changzhou Filamentlux Smart Technology Co., LTD
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1.72mm Surface Mount PCB Assembly
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...substrate. 2. Used for imaging system. 3. Reflow wave soldering. 4. 0201 minimum length of tape with components. 5. E-test and function test ok then shipment. 1 Layers 6 layer 2 PCB material FR4 TG135 3 PCB thickness 1.72mm 4 Usage Imaging system 5 Surface finish HASL 6 Min hole 0.15mm 7 Mini chip part 0201 min package......
Abis Circuits Co., Ltd.
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